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COPPER PLATING ADVANCED MULTILAYER BOARDS.ALPAUGH WA; MCCREARY JM.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 3; PP. 27-32Article

NICKEL-PHOSPHOR-DUENNSCHICHTWIDERSTAENDE = (RESISTANCES A COUCHES MINCES NICKEL-PHOSPHORE)OSTWALD R.1980; WISS. BER.-AEG-TELEFUNKEN; ISSN 0043-6801; DEU; DA. 1980 PUBL. 1981; VOL. 53; NO 4-5; PP. 177-185; ABS. ENG; BIBL. 34 REF.Article

ELECTROLESS PLATING OF GOLD ON GAAS FOR FAST CHARACTERIZATION OF THIN EPITAXIAL LAYERSDONZELLI GP; GUARINI G; VIDIMARI F et al.1978; THIN SOLID FILMS; NLD; DA. 1978; VOL. 55; NO 1; PP. 25-33; BIBL. 8 REF.Article

A MODIFIED ELECTROLESS METHOD FOR THE FABRICATION OF MICROSTRIP LINES ON ALUMINA SUBSTRATES.SESHADRI TK; MAHAPATRA S.1977; INTERNATION. J. ELECTRON.; G.B.; DA. 1977; VOL. 43; NO 5; PP. 461-464; BIBL. 4 REF.Article

A NEW ELECTROLESS METHOD FOR LOW-LOSS MICROWAVE INTEGRATED CIRCUITSMAHAPATRA S; PRASAD SN.1978; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1978; VOL. 1; NO 4; PP. 428-431; BIBL. 7 REF.Article

CHARACTERISTICS OF METAL-SEMICONDUCTOR CONTACTS FABRICATED BY THE ELECTROLESS DEPOSITION METHODDATTA AK; GHOSH K; CHOWDHURY NKD et al.1980; SOLID-STATE ELECTRON.; GBR; DA. 1980; VOL. 23; NO 8; PP. 905-907; BIBL. 8 REF.Article

THIN-FILM FORMATIONVOSSEN JL; KERN W.1980; PHYS. TODAY; ISSN 0031-9228; USA; DA. 1980; VOL. 33; NO 5; PP. 26-33; BIBL. 16 REF.Article

THE FABRICATION OF SCHOTTKY-BARRIER SOLAR CELLS BY ELECTROLESS NICKEL PLATINGLUE JT.1979; APPL. PHYS. LETTERS; USA; DA. 1979; VOL. 34; NO 10; PP. 688-690; BIBL. 15 REF.Article

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